Cookie Usage Statement

We use cookies to enhance your experience while using our website. Read our Cookie Statement

Hide Message

Course Profile

Compound Semiconductor Device Fabrication

The fabrication of Micro- and Nano-technologies devices are today, part of the "Smart solutions" in automotive, biomedical, and electromechanical engineering. Students in taking this device fabrication course will have the opportunity to fabricate a LASER, in the Tyndall National Institute, Training lab. The course allows the student to have a hands-on approach to fabrication of the LASER device and thereby understanding the fundamental principles of a LASER



  • Introduction to processing
  • Laboratory discipline and safety
  • Four high level talks on:
    1. Materials for Device Processing and key emphasis on compound semiconductor materials.
    2. The fundamental principles of how a LASER works
    3. Gallium Nitride LEDs and Detectors
    4. Silicon v Photonics Processing
  • Materials for III-V Devices, Lasers, LEDs and Detectors
  • Four process topics:
    1. Photo-Lithography and device patterning
    2. Etch of materials
    3. Dielectrics
    4. Metal contacts
  • Laboratory sessions on substrate handling, Lithography, PECVD, Etch, Lift-off, Metallization, substrate thinning and device test
  • After testing the fabricated lasers, a guided tour about  Laser packaging facilities  and the III-V material growth systems in Tyndall will be provided to the course participants.


Course Outcomes

On successful completion of this module, students should be able to:

  1. Understand the sub-technologies such as; photolithography, etching, metal deposition, thermal treatments and measurement that form the full compound semiconductor device fabrication process.
  2. Understand the relationship between materials used, process techniques and how these two factors are used to fabricate devices such as semiconductor lasers, LEDs and various detectors.
  3. Test a simple device and understand the relationship between process parameters and device characteristics.
  4. Recognise the differences but also see the similarities between silicon IC fabrication and compound semiconductor device fabrication.

Delivery Information

5 days Block Delivery

Assessment Information

Assessment: Total Marks 100:

  • Continuous Assessment 100 marks (Process techniques and session attendance, 60 marks; final report, 40 marks)
  • Compulsory Elements: Continuous Assessment

Examination Information

Pass Standard and any Special Requirements for Passing Module: 40% Students must pass all elements of Continuous Assessment independently.End of Year Written Examination Profile: No End of Year Written Examination.
Starting : December 12th - 16th 2016
Location : Tyndall National Institute
Category : Information and Communications Technology , Photonics
Schedule : 5 day block on-site delivery at Tyndall National Institute
Workload : 5 full days including laboratory, lectures. A report written after the course is also expected
Weighting : 5 ECTS

Accrediting Institution(s)

University College Cork
College Road, Cork, Ireland

Course Provider(s)